Assembly&Test Technical Services

We can provide complete scheme includes assembly design, assembly, electrical test and reliability test.

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Assembly Technical Advantage

Intelligent power module package

IPM Product Development Direction

Intelligent power module package


Key quality indicators monitoring

For key quality indicators, formulate control plan, quality control implement SPC monitoring, and mass production shall meet CPK>1.33

Intelligent power module package


Product intellectual property description

The company's IPM products have a number of national patents, and the list is as follows:

Patent NumberPatent NamesPatent Type
201822219818.9Thermolysis intelligent power semiconductor module based on micro-level SSOP packageUtility Model Patent
201910258532.8Method of improving warpage of intelligent power semiconductor module products by moldInvention Patent
201920439829.XMold to improve warpage of intelligent power semiconductor module productsUtility Model Patent
201920439824.7Mold for improving warpage of intelligent power semiconductor module productsUtility Model Patent
201921393944.4Thermolysis intelligent power semiconductor device based on micro-level SSOP packageUtility Model Patent
201921393943.XThermolysis intelligent power control structure based on micro-level SSOP packageUtility Model Patent
201910867988.4Thermolysis intelligent power semiconductor module based on micro-level SSOP package and its preparation method and applicationInvention Patent

Application Field

Applied to mobile phones, computers, automotive electronics, white goods and industrial control equipment.

Intelligent power module package