Language
Third-generation semiconductor package
Technical characteristics
● Develop SiC and GaN wafer scribing technology
● Application of soft solder and high thermal conductivity Ag sintering
● DBC multi-die stack packaging technology
● High performance Cu clip and ribbon bonding and hybrid bonding technology
● Packaging technology of SiC ultra-thin die
● The product voltage can be 3300V, which meets the assessment standard of AECQ101
● Use highly reliable green molding compound
Application Field
The third generation of semiconductors are used in mobile phone chargers, 5G base stations, electric vehicles, military fields, etc.
Package of Products
| Package | Product picture | Package | Product picture |
|---|---|---|---|
| TO-220 |  |
TO-3P |  |
| TO-263 |  |
TO-247 |  |
| TO-220F |  |
TO-264 |  |
| Package | Product picture |
|---|---|
| TO-220 | |
| TO-3P | |
| TO-263 | |
| TO-247 | |
| TO-220F | |
| TO-264 | |
