Assembly Technical Advantage

Technology

The diffiCulty of ultra-thin die packaging lies in die saw and die bond. The problem of picking up the upper core of ultra-thin die is solved by using the UV-type and irradiation process. At present, the manufacturing process of ultra-thin die is mature and stable, and can support Wafer packaging with a thickness of 50μm and above. The packaging yield is above 99.82%. The product grade meets the industrial-grade quality requirements

Some major technological processes:

技术特点

●   Development of die sawing and die bonding technology for ultra-thin die
●   Void control technology of soft solder core on large die.
●   Using high thermal conductivity and conductive Ag sintering to achieve zero voids.
●    Development DBC multi-die stack packaging technology
●   High performance Cu clip and ribbon bonding and hybrid bonding technology
●   Use highly reliable green molding compound
●   Applicable to all package.

Application Field

At present, packaging products are used in industrial control, consumer electronics, computer, network communication and other fields.