On July 20th and 21st, the 17th Annual Meeting of Semiconductor Discrete Devices of China Semiconductor Industry Association and 2023 China Semiconductor Devices Technology Innovation and Industry Development Forum was held in Hangzhou New Century Grand Hotel. This event is an important academic and technical exchange activity for semiconductor power devices in China. As China's leading semiconductor power device manufacturer, HuaYi Microelectronics was invited to attend this event to talk about the new development of the semiconductor industry with industry experts.

At the meeting on July 20th, Liu Yifang, Product and Technology Director of Huayi Microelectronics, delivered a report on the topic of "Designing and Building Highly Reliable Power Systems". In the report, he talked in detail about the requirements of power system on power devices, the improvement of reliability, failure model and failure analysis.

On July 21st, Huayi Microelectronics Packaging Technology Director Zhao Wentao was invited by the organizing committee to present a report on "Power Device Packaging Heat Dissipation Research", which details the heat dissipation requirements of power devices, the factors affecting heat dissipation of power devices, and how to improve the heat dissipation ability of power devices from the perspective of packaging.

At the booth, Huayi Microelectronics not only displayed the latest MOSFET and power module products and solutions, but also demonstrated different types of packaging and testing services from low-voltage to high-voltage, such as: third-generation semiconductor packaging and testing, automotive-grade power device packaging and testing, IPM module, ultra-thin chip packaging and testing, and high reliability power device packaging and testing, Huayi Microelectronics actively cooperated with the industry players in the field of power device packaging and testing.

Huayi Microelectronics actively communicated with the industry and laid a good foundation for further market development.