On August 10, "2023 China Automotive Semiconductor New Ecology Forum" and "The Fifth Taihu Chip Summit" were successfully held at the conference center of Wuxi Taihu Lake Hotel, hosted by the People's Government of Binhu District and the Bureau of Industry and Information Technology of Wuxi City, organized by the Management Committee of Liyuan Economic Development Zone of Wuxi City, Jiangsu Province, the Bureau of Industry and Information Technology of Binhu District, the Wuxi Integrated Circuit Society, and Shenzhen Zhenlibao Information Technology Co. The "Fifth Taihu Lake Core Summit" was successfully held in the conference center of Wuxi Taihu Lake Hotel, where government leaders, academicians and experts, and industry representatives gathered in Taihu Lake to talk about the automotive chip industry.
Under the guidance of Wuxi Integrated Circuit Society and after the evaluation by the expert group, during the meeting, Core List and Asia-Pacific Core Valley Technology Research Institute jointly announced that HuaYi Microelectronics was honored to be on the list of "Core List - Core Future - 2023 China's Most Valuable Automotive Chip Enterprises for Investment". This award reflects the industry's full recognition of Houyi's automotive-grade MOSFET products.
Junya Zhao, director of automotive products of Hua Yi Microelectronics, was invited to attend the award ceremony, and was invited by the organizing committee to deliver a report on "Power Semiconductor Automotive "Core"", and at the same time showed the company's practical achievements in the field of automotive-grade MOSFETs.
The conference centered on automotive chip technology, automotive-grade power device chips, hardware and software security, AI technology empowered to improve the yield rate of automotive core and other 20 hot topics for the automotive semiconductor industry to create a high-end communication feast.
Huayi Microelectronics adopts the "Fabless + OSAT" dual-wheel drive business model, its own products include SGT MOSFET, Trench MOSFET, system-level power modules, product quality level covering automotive grade, industrial grade, and consumer grade, widely used in automotive electronics, industrial control, servers, New energy, electric tools, drones, consumer electronics and other fields. Our power device packaging and testing products cover a full range of low-voltage to high-voltage MOSFETs, IGBTs, IPMs, and third-generation semiconductors, with more than 70 types of packages in five series: TOLL, TO fully encapsulated, TO semi-encapsulated, PPAK, and IPM.
In the field of automotive electronics, Huayi Microelectronics comprehensive layout of the automotive electronics market, continue to break through the automotive MOSFET R & D innovation level, steadily enrich the product matrix, strict control of product quality, has become a minority of domestic can provide automotive-grade MOSFET products of high quality suppliers. The company's automotive-grade power device packaging and testing line has passed the IATF16949 automotive quality management system certification, while the company's testing center has passed the CNAS certification, with the ability to carry out testing in accordance with AEC guidelines.